Mitani Shoji Co., Ltd

Support for your cost down by plating

• We support your cost down for plating, from design stage or prototype to mass production.
• Based on our sufficient experience and knowledge, we propose you the optimum specifications of plating for your requirement and the most competitive maker in quality, price & delivery. Thus, we support you in an aspect of process.
• We assist you to achieve cost down from the stage of designing.

Example of Pre-plating

Example of Spot plating

Lead free plating

We commit ourselves in our environmental policy to propose environment-friendly material & process method to customer. In the field of electronics industries, minimizing risk of whisker growth, solderability, adhesion strength, melting temperature are important factors to determine specifications for plating. Lead free plating processes which we propose are Sn Hot-Dip, Sn-Ag Hot-Dip, Sn Reflow, Sn Reflow with thick tin coating, Sn-Bi, Sn-Cu, etc.

Advantage of Sn Reflow with thick tin coating

Thickness of tin coating of the conventional Sn Reflow was 1.0 to 2.0 micron in general. Thin tin coating cannot assure good solderability and adhesion strength. On the other hand, the conventional Sn Reflow with thick tin coating had disadvantages such as quality of surface condition is not so good, fluctuation of coating thickness is big. Sn Reflow which we propose as a solution has the following features.

• Maximum thickness of tin coating 5 micron (after reflow treatment)
• Excellent solderability
• Uniform distribution of thickness of tin coating and quality of surface is good having mirror gloss.
• Reflow treatment minimize risk of whisker growth.

• We can propose Differential thickness plating (which can limit thick plating only for the place required so).
• We can propose Pd-Ni alloy plating.
• We can propose to provide selective Au plating after initial stamping to minimize quantity of Au.s